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학술대회 A Surface Micromachined MEMS Capacitive Microphone with Back-Plate Supporting Pillars
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저자
제창한, 이재우, 양우석, 권종기
발행일
201311
출처
SENSORS 2013, pp.1-4
ISSN
1930-0395
출판사
IEEE
DOI
https://dx.doi.org/10.1109/ICSENS.2013.6688399
협약과제
13VB1600, 스마트&그린 빌딩용 자가충전 지능형 센서노드 플랫폼 핵심기술 개발, 권종기
초록
We present a new surface micromachined MEMS capacitive microphone with improved frequency response and high sensitivity. The proposed MEMS microphone has a top back-plate with a bottom sensing membrane and the back-plate is supported by supporting pillars which are anchored to the bottom of the deep back chamber. The back-plate supporting pillars increase the stiffness of the back-plate and prevent deformation. A present surface micromachined MEMS capacitive microphone is fabricated using fully CMOS compatible processes. It has a thin metal membrane of 500 μm diameter, a sensing air gap of 2.5 μm and seven back-plate supporting pillars. A 100 μm deep back chamber is formed by xenon difluoride dry etching of silicon substrate. As a result, the proposed microphone shows a flat frequency response and high open-circuit sensitivity. It shows a measured zero-bias capacitance of 1.0 pF and a pull-in voltage of 11.0 V, and an open-circuit sensitivity of 10.37 mV/Pa on a DC bias of 6.0 V. © 2013 IEEE.
KSP 제안 키워드
Air-gap, Back-plate, CMOS-compatible, Flat frequency response, Frequency response(FreRes), High Sensitivity, MEMS Microphone, MEMS capacitive microphone, Metal membrane, Open circuit, Sensing membrane