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학술지 Siliconized Silsesquioxane-Based Nonstick Molds for Ultrahigh-Resolution Lithography
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이봉국, 박건식, 김동표, 류진화, 박재훈, 정예슬, 백규하, 도이미
Journal of Materials Chemistry, v.22 no.33, pp.16754-16760
Royal Society of Chemistry (RSC)
A material approach to fabricating high-performance nonstick molds for manufacturing ultrahigh-resolution features (<8 nm) is presented. Low-viscosity liquid blends (4-121 cP) consisting of siliconized silsesquioxane acrylate (Si-SSQA) with low surface energy and difunctional acrylics were used as nonstick replica-mold materials. The cured Si-SSQA-acrylic networks showed a high UV transparency (>92% at 365 nm), high modulus and wide-range modulus tunability (0.757-4.192 GPa), high resistance to organic solvents (<1.2 wt%), low shrinkage (<3%), and high water contact angle (91-103째). The Si-SSQA-acrylic blends with a nonstick property were easily transferred to high-resolution replica molds with sub-25 nm features, a pitch of 25 nm and a height of 100 nm, even if the release agent was not modified onto the master. In addition, nonstick replica molds with a low concentration of uncross-linked (meth)acrylate showed the ability to duplicate ultrasmall nanostructures with a sub-8 nm parallel line, a pitch of 17 nm and a height of 6-7 nm. Furthermore, the Si-SSQA-based replica mold prevented the formation of bubble defects during imprinting owing to sufficient gas permeability. © The Royal Society of Chemistry 2012.
KSP 제안 키워드
65 nm, Bubble defects, Contact angle(CA), Gas permeability, High modulus, High performance, High resistance, High water, High-resolution, Low concentration, Low shrinkage