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학술지 Novel Bumping Material for Solder-on-Pad Technology
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저자
최광성, 추순우, 이종진, 성기준, 배현철, 임병옥, 문종태, 엄용성
발행일
201108
출처
ETRI Journal, v.33 no.4, pp.637-640
ISSN
1225-6463
출판사
한국전자통신연구원 (ETRI)
DOI
https://dx.doi.org/10.4218/etrij.11.0210.0298
협약과제
10MB2100, 웨이퍼레벨 3차원 IC 설계 및 집적기술, 최광성
초록
A novel bumping material, which is composed of a resin and Sn3Ag0.5Cu (SAC305) solder power, has been developed for the maskless solder-on-pad technology of the fine-pitch flipchip bonding. The functions of the resin are carrying solder powder and deoxidizing the oxide layer on the solder power for the bumping on the pad on the substrate. At the same time, it was designed to have minimal chemical reactions within the resin so that the cleaning process after the bumping on the pad can be achieved. With this material, the solder bump array was successfully formed with pitch of 150 챙m in one direction. © 2011 ETRI.
키워드
Maskless bumping, Resi, Sn3Ag0.5Cu solder, Solder-on-pad (SoP) technology
KSP 제안 키워드
Cleaning process, Fine pitch, Oxide layer, Solder bump, chemical reaction(Biomimetic)