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학술지 Development of Flat-Plate Cooling Device for Electronic Packaging
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저자
문석환, 황건, 임현택
발행일
201108
출처
ETRI Journal, v.33 no.4, pp.645-647
ISSN
1225-6463
출판사
한국전자통신연구원 (ETRI)
DOI
https://dx.doi.org/10.4218/etrij.11.0210.0322
협약과제
09MB7700, 솔라셀 증착용 온도균일화 장치 개발, 문석환
초록
In this study, a microcapillary pumped loop (MCPL) that can be used as a cooling device for small electronic and telecommunications equipment has been developed. For thin devices such as an MCPL, securing a vapor flow space is a critical issue for enhancing the thermal performance. In this letter, such enhancement in thermal performance was accomplished by eliminating condensed droplets from the vapor line. By fabricating the grooves in the vapor line to eliminate droplets, a decrease in thermal resistance of about 63.7% was achieved. © 2011 ETRI.
키워드
Condensed droplet, Electronic cooling, Phase change, Thermal packaging, Thermal resistance
KSP 제안 키워드
Electronic cooling, Flat plate, Flow space, Phase change, Vapor flow, cooling device, electronic packaging, thermal performance, thermal resistance