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학술지 Optical Interconnection Platform Composed of Fiber-Embedded Board, 90˚-Bent Fiber Block, and 10-Gb/s Optical Module
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저자
황성환, 조무희, 강세경, 조한서, 이태우, 박효훈
발행일
200806
출처
IEEE/OSA Journal of Lightwave Technology, v.26 no.11, pp.1479-1485
ISSN
0733-8724
출판사
IEEE, OSA
DOI
https://dx.doi.org/10.1109/JLT.2008.922166
협약과제
07MT2400, OTH기반 40G급 다중서비스 전송 기술개발, 고제수
초록
An architecture of a passively assembled optical platform is suggested for a chip-to-chip optical interconnection system. The platform is constructed using all-fiber media for the optical paths: a fiber-embedded optical printed-circuit board (OPCB) and 90째-bent fiber connector. The passive assembling was achieved by employing the guide pins/holes of commercialized ferrules in the optical link between the OPCB, 90째-bent fiber connector, and the transmitter/receiver (Tx/ Rx) module. From this interconnection scheme, a low total optical loss of -5.3 dB was obtained. From an assembled platform with 10 Gb/s/ch × 4 ch Tx/Rx modules, a 7-Gb/s/ch data transmission was demonstrated with a bit error rate below 10-12, involving the optical and electrical crosstalk arisen in the whole channel operation. © 2008 IEEE.
키워드
90째-Bent fiber block, Chip-to-chip optical interconnection, Optical modules, Optical printed circuit board (OPCB), Passive assembly
KSP 제안 키워드
All-fiber, Bent fiber, Bit Error Rate(And BER), Chip-to-chip optical interconnection, Data transmission, Embedded board, Optical loss, Optical module, Optical platform, Optical printed circuit board(OPCB), Passive assembly