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학술지 Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining
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저자
최광문, 장기석, 최광성, 주지호, 윤호경, 이찬미, 엄용성
발행일
202103
출처
Polymers, v.13 no.6, pp.1-14
ISSN
2073-4360
출판사
MDPI
DOI
https://dx.doi.org/10.3390/polym13060957
협약과제
21PB2200, 도전성 접합소재 및 미니 LED 패키지 기술개발, 엄용성
초록
An epoxy-based solder paste (ESP) is a promising alternative to conventional solder pastes to improve the reliability of fine-pitch electrical joining because the epoxy encapsulates the solder joint. However, development of an appropriate epoxy formulation and investigation of its reaction mechanism with solder powder is challenging. In this study, we demonstrate a newly designed ESP consisting of diglycidyl ether of bisphenol F (DGEBF) resin, Sn-3.0 Ag-0.5 Cu (SAC305) solder powder, and L-glutamic acid (Glu), which is a proteinogenic amino acid for biosynthesis of proteins in living systems. The mechanism of the thermochemical reaction was explored and tentatively proposed, which reveals that the products of the reaction between SAC305 and Glu function as catalysts for the etherification of epoxides and alcohols produced by chemical bonding between DGEBF and Glu, consequently leading to highly crosslinked polymeric networks and an enhancement of impact resistance. Our findings provide further insight into the mechanism of the reaction between various formulations comprising an epoxy, amino acid, and solder powder, and their potential use as ESPs for electrical joining.
키워드
Electrical joining, Epoxy-based solder paste, Etherification, L-glutamic acid, Tin carboxylate salt
KSP 제안 키워드
Amino acid, Bisphenol F, Chemical bonding, Diglycidyl ether, Epoxy-based, Fine pitch, L-Glutamic acid, Polymeric networks, Reaction mechanisms, Solder joint, Solder paste
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