Subjects : Mass reflow
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2011 | Bumping and Stacking Processes for 3D IC using Fluxfree Polymer Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2011, pp.1746-1751 | 3 | 원문 |
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| Type | Year | Research Project | Primary Investigator | Download |
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