Subjects : Sn-58Bi solder
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2009 | Novel Bumping Material for Stacking Silicon Chips Choi Kwang-Seong Electronics Packaging Technology Conference (EPTC) 2009, pp.579-583 | 2 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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