Subjects : Impact resistance
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2021 | Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining Gwang-Mun Choi Polymers, v.13, no.6, pp.1-14 | 12 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
|---|---|---|---|---|---|
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| Type | Year | Research Project | Primary Investigator | Download |
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