Subjects : hermetic package
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2025 | Development of Hermetic package with 3.3kV SiC PIN diode Oh Ae Sun 한국전기전자재료학회 학술 대회 (하계) 2025, pp.51-51 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
|---|---|---|---|---|---|
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| Type | Year | Research Project | Primary Investigator | Download |
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