Subjects : Conformal deposition
| Type | Year | Title | Cited | Download |
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| Journal | 2011 | Conformal Deposition of an Insulator Layer and Ag Nano Paste Filling of a through Silicon Via for a 3D Interconnection Baek Kyu-Ha Journal of the Korean Physical Society, v.59, no.3, pp.2252-2258 | 10 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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