Subjects : semiconductor bonding
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2019 | Advanced Interconnection technology with Laser Assisted Bonding Process for PET Substrate Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2019, pp.1-5 | 0 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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