Subjects : Heat-curable
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2017 | Solvent-free Fluxing Underfill Film for Electrical Interconnection Keonsoo Jang European Microelectronics and Packaging Conference (EMPC) 2017, pp.1-4 | 3 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
|---|---|---|---|---|---|
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| Type | Year | Research Project | Primary Investigator | Download |
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