Subjects : area array
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2009 | Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive) 임병승 Materials Transactions, v.50, no.7, pp.1684-1689 | 7 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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