Subjects : Electronic cooling
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2014 | Thermal Analysis and Testing of a Heat Pipe With Woven Wired Wick Moon Seok-Hwan IEEE Transactions on Components, Packaging, and Manufacturing Technology, v.4, no.6, pp.991-998 | 6 | 원문 |
| Conference | 2007 | Development of the Micro Capillary Pumped Loop for Electronic Cooling Moon Seok-Hwan International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC) 2007, pp.72-76 | 8 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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