Subjects : Glass wafer
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2021 | Development of simultaneous transferring and bonding (SITRAB) process for µLED arrays using Anisotropic Solder Paste (ASP) and Laser-Assisted Bonding (LAB) Technology Jiho Joo Electronic Components and Technology Conference (ECTC) 2021, pp.687-692 | 5 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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