Subjects : Transient liquid-phase
| Type | Year | Title | Cited | Download |
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| Journal | 2019 | Conductive adhesive with transient liquid‐phase sintering technology for high‐power device applications Eom Yong Sung ETRI Journal, v.41, no.6, pp.820-828 | 11 | 원문 |
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| Type | Year | Research Project | Primary Investigator | Download |
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