Subjects : Thermosetting materials
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2024 | Laser Assisted Bonding (LAB) based Flip-chip process for fine pitch solder bumps device using Laser Non-Conductive Paste (NCP) Jang Ki Seok Electronic System-Integration Technology Conference (ESTC) 2024, pp.1-4 | 0 | 원문 |
| Conference | 2008 | Thermal Latent Catalytic Behavior of a Sn/Bi Metal Powder in Thermosetting Materials Jang Keonsoo International Conference on Nanoscale Materials and Engineering (ICNME) 2008, pp.1-1 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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