Subjects : Electrical reliability
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2021 | Thermal and Electrical Reliability Analysis of TO-247 for Bonding Method, Substrate Structure and Heat Dissipation Bonding Material Donghwan Kim Electronic Components and Technology Conference (ECTC) 2021, pp.1950-1956 | 5 | 원문 |
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| Type | Year | Research Project | Primary Investigator | Download |
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