Subjects : void formation
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2025 | Reliability Enhancement of 30 μm-Pitch Interconnections via Room-Temperature Laser-Assisted Bonding with Compression (LABC) Using Optimized Laser Non-Conductive Paste (LNCP) Lee Gaeun Journal of Korean Institute of Metals and Materials, v.63, no.8, pp.583-593 | 0 | 원문 |
| Journal | 2024 | Thermo-mechanical properties of shape-recoverable structural composites via vacuum-assisted resin transfer molding process and in-situ polymerization of poly (tert-butyl acrylate-co-acrylic acid) copolymer 전재경 Composites Part A: Applied Science and Manufacturing, v.185, pp.1-11 | 4 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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