Subjects : 3D X-Ray
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2023 | In-line stationary multi-source tomosynthesis for high throughput 3D X-ray inspection: a simulation study Choi Sunghoon SPIE Medical Imaging 2023 (SPIE 12463), pp.1-6 | 0 | 원문 |
| Conference | 2010 | Optimized TSV Process using Bottom-up Electroplating without Wafer Cracks 임병옥 Electronic Components and Technology Conference (ECTC) 2010, pp.1642-1646 | 6 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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