Inventors

Kim Junsoo, 권정윤, Jaewoo Lee, Moon Seungeon, Lee Seung Min, Im Solyee

Application No.

15656711 (2017.07.21)

Publication No.

20180119999 (2018.05.03)

Registration No.

10571161 (2020.02.25)

Country

UNITED STATES

Abstract

Provided is a cooling device including a valve structure including a temperature-responsive material that changes in volume in response to changes in temperature, a supporting structure, which is joined to the valve structure and supports the valve structure, and a solvent which contacts the valve structure, wherein a portion of the solvent contacts the valve structure and another portion of the solvent is externally exposed, the valve structure changes in volume in response to changes in temperature and thereby regulating the externally exposed surface area of the solvent.

KSP Keywords

Exposed surfaces, Surface Area, Valve structure, cooling device, responsive material, structure changes, supporting structure, temperature-responsive, temperature-responsive material

Family

 

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Status	Patent	Country	KIPRIS
Registered	냉각 소자	KOREA	KIPRIS