Inventors

Application No.

2022-0132231 (2022.10.14)

Publication No.

10-2024-0008765 (2024.01.19)

Registration No.

2785210 (2025.03.18)

Country

KOREA

Project Code

22JB1900, Development of multi-functional core materials of transfer and bonding process for micro LEDs, Choi Kwang-Seong

22JB1700, Development of electroplating materials for semiconductor high-density modules, Eom Yong Sung

, ,

22PB3500, Technology of conductive interconnction material and mini LED package, Eom Yong Sung

Family

 

패밀리 특허 목록

Status	Patent	Country	KIPRIS
Registered	접합 장치	KOREA
Registered	접합 장치	KOREA
Registered	접합 장치	KOREA