조성물, 및 이를 이용한 솔더 범프 형성방법 및 플립칩 형성방법
엄용성, 문종태, 장건수, 오상원
- 8420722 (2013.04.16)
- Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.
- KSP 제안 키워드
- Low melting, Low melting point, Polymer resin, Solder bump, anisotropic conductive adhesive, conductive adhesive, curing agent, flip chip, melting point