ETRI-Knowledge Sharing Plaform

ENGLISH

성과물

특허 검색
구분 출원국
출원년도 ~ 키워드

상세정보

등록 플립 칩 본딩 방법 및 그의 구조

플립 칩 본딩 방법 및 그의 구조
이미지 확대
발명자
엄용성, 문종태, 최광성
출원번호
12761715 (2010.04.16)
공개번호
20110089577 (2011.04.21)
등록번호
8211745 (2012.07.03)
출원국
미국
협약과제
초록
Provided is a method and structure for bonding a flip chip while increasing the manufacturing yield. In the method, solder bumps are formed on first electrodes and/or second electrodes disposed on first and second substrates, respectively. In addition, the first and second electrodes are arranged to face each other with a second resin including spacer balls being disposed between the first and second substrates. In addition, while flowing the second resin, the first and second substrates are pressed until the distance between the first and second substrates is decreased smaller than diameter of the spacer balls so as to connect the solder bumps between the first and second electrodes.
KSP 제안 키워드
Manufacturing yield, Solder bump, flip chip