열방출이 용이한 반도체 기판의 비아홀 제작 방법
민병규, 김성일, 윤형섭, 이종민, 문재경
- 8692371 (2014.04.08)
- Disclosed are a semiconductor apparatus and a manufacturing method thereof. The manufacturing method of the semiconductor apparatus includes: forming a semiconductor chip on a semiconductor substrate; adhering a carrier wafer with a plurality of through holes onto the semiconductor chip; polishing the semiconductor substrate; forming a first via hole at the rear side of the polished semiconductor substrate; forming a first metal layer below the polished semiconductor substrate and at the first via hole; and removing the carrier wafer from the polished semiconductor substrate.
- KSP 제안 키워드
- Manufacturing method, Semiconductor chip, Via-hole, metal layer, rear side, semiconductor substrate, through-holes