3차원 인터커넥션 방법 및 이를 이용한 장치
임권섭, 고재상, 강현서
- 9240363 (2016.01.19)
- Provided are a three-dimensional (3D) interconnection structure and a method of manufacturing the same. The 3D interconnection structure includes a wafer that has one side of an inverted V-shape whose middle portion is convex and a lower surface having a U-shaped groove for mounting a circuit, and a first electrode formed to cover a part of the inverted V-shaped one side of the wafer and a part of the U-shaped groove.
- KSP 제안 키워드
- 3D interconnection, Interconnection structure, Three dimensional(3D), U-shaped, V-shape, V-shaped