고주파 신호 전달을 위한 광모듈 패키징 방법
한영탁, 신장욱, 한상필, 박상호, 백용순
- 9069146 (2015.06.30)
- Provided is an optical module. The optical module includes: an optical bench having a first trench of a first depth and a second trench of a second depth that is lower than the first depth; a lens in the first trench of the optical bench; at least one semiconductor chip in the second trench of the optical bench; and a flexible printed circuit board covering an upper surface of the optical bench except for the first and second trenches, wherein the optical bench is a metal optical bench or a silicon optical bench.
- KSP 제안 키워드
- Circuit Board, Flexible Printed Circuit, Flexible printed circuit board(FPCB), Optical module, Semiconductor chip, Silicon optical bench(SIOB), printed circuit, printed circuit board(PCB)