다층배선 기술을 이용한 적층형 programmable 가변 인덕터
김천수, 박필재, 유현규, 박문양
- 6992366 (2006.01.31)
02MB3200, 1~5GHz 대역 직접 변환 다중밴드 통합 칩 기술개발,
- Disclosed is a stacked variable inductors manufactured by stacking M (M≧2) metal layers on a semiconductor substrate, and provides stacked variable inductors comprising, 1 to N inductors continuously connected in serial, wherein each of said inductors is formed on N (N≦M) metal layers that are different each other; first and second ports each connected to the highest positioned inductor and to the lowest positioned inductor among said 1 to N inductors; and at least one MOSFET, and wherein one terminal of at least one MOSFET is connected to one of the first and second ports, and the other one is connected to one of adjacent terminals connected in serial between 1 to N inductors.
- KSP 제안 키워드
- One terminal, Variable Inductor, metal layer, semiconductor substrate