ETRI-Knowledge Sharing Plaform

Plasma-Enhanced Atomic Layer Deposition Electrical Properties(I-V curve) Trench Gate Amorphous Silicon Thin-Film Transistors(a-Si TFTs) Field Emission Display Emitter Arrays Plastic Substrate Field Emitter Array High Performance Self-Aligned Electrical Characteristics Gate Oxide Dielectric Constant Low-Temperature Process Plasma Oxidation Glass Substrate High-Density Sequential Lateral Solidification Doping Concentration High Voltage Trench Power Mosfets Si Substrate Thermocompression Bonding Bonding Process Highly Reliable Process Conditions Insulation Layer Next-Generation Polycrystalline Silicon Thin-Film Transistor Buffer Structure Cost-Effective Dielectric Films Field-Effect Transistors(FETs) Mesh-Type Sio 2 Defect Passivation High Temperature Monolithically Integrated RC-IGBT Simulation Study Electrical Loss Nano-Scale Poly-Si Film Process Technology Specific On-Resistance Low-Temperature Polycrystalline Silicon(LTPS) 3 V Blocking Voltage Cell Density Deep Trench Flexible Substrate Si Etching Solder Bumping Transmission Line Thin Film Deposition Thermal Performance Active Layer Boron Doping Capacitance-Voltage Display Applications Diffusion Temperature Electron Beam Poly-Si Thin Film Power Amplifiers(PAs) Triple-Gate Anisotropic Conductive Film Active Matrix Active Devices Cooling Method Edge Termination Laser Treatment Low Voltage N-Channel Control Device Curing Kinetics Carbon Wire Laser Energy Low-Cost Lateral Diffusion Low Temperature Bonding Oxide Film Surface Treatments Trench Etching Doping Process Etch Selectivity Flat Heat Pipe Gate Electrode Ict Convergence Low Leakage Current Light-Emitting Diode(LED) Process Temperature Power Consumption Thermoelectric Cooler Uniformly Distributed Cu Paste Electrical Performance Flexible Metal Foil Field Emission Properties Light Shield Melting Temperature(Tm) Metal-Oxide-Semiconductor Field-Effect Transistor(MOSFET) Motor Drive Application 10 Ghz Drain Current Fabrication Process Metal Filler Microstrip Line Printing Technology Process Simulation Silicate Glasses Silicon Deep Etching Wet Etching Process Threshold Voltage(Vth) Anode Voltage Back Channel Gate Dielectric Film Process Complexity Reliability Test Solder Paste Surface Roughness Aluminum Silicate Cathode Electrode Forming Processes Gate Bias Gate Voltage Good Stability Large Grain Low Temperature Poly-Si Matrix Field Si Surface Shield Layer Silicon Process X-Band Radar Ag-Coated Cu Bipolar Transistors Breakdown Field Cross-Sectional Analysis Dc Power Dc Resistance Enhanced Adhesion Excellent Performance Flexible Packaging Flexible Device Gas Composition Hysteresis Voltage Heat Sink Heat Dissipation Interlayer Dielectric Interconnection Structure Ultra-Thin Oxidation Temperature Lightly Doped Drain(LDD) Nanoimprint Lithography Nano-Sized Optical Microscope Power System Application Performance Improvement Off-State Stress Photolithography Process Patterning Method Polycrystalline Silicon Film Power Array Rf Module Resistance Measurement Radio Frequency(RF) Response Time Self-Limiting Si Interposer Surface Layer Spacer Technology Wet Chemical Working Gas Underfill Materials Color Field Temperature Range Vacuum Packaging 10 Kv Zirconium Oxide X-Ray Photoelectron Spectroscopy (Xps) As Impurity Bump Pitch Charge Balance Curing Agent Coplanar Waveguide Feeding(CPW) Copper Paste Ceramic Substrate Cooling Capacity Corner Effect Etch Profile Emitting Diodes Energy Transfer High-Quality Gate Width Hydrogen Annealing Heat Treatment Process Interface Oxide Joint Properties Low-Temperature Growth Lead-Free Soldering Master Mold Materials Design Operation Performance Pn Junction Diode Probe Method P-Well Plasma-Assisted Physical Vapor Deposition Reverse Leakage Current Recovery Current Rf Power Amplifier Rf Magnetron Sputter Red Emitting Silicon Dioxide Surge Current Transistor Characteristics Ultra-Low Temperature Titanium Silicide Emission Characteristics Tsv Liner Trade-Off 3d Stacked 5 Nm Temperature Distribution Annealing Process Applied Physics Boron Diffusion Close Contact Conductive Paste Catalytic Effect Driving Voltage Die Attachment E-Beam Enhanced Cooling Excimer Laser Annealing Forward Voltage Flexible Display Flip-Chip Bonding Hydrogenated Amorphous Silicon High Resistivity Si Heat Spreader High-Resolution Heat Flux Heat Source High Breakdown Voltage Internet Of Thing(IoT) Insertion Loss Joint Formation Leakage Current Density Laser Processing Low Temperature Cofired Ceramic(LTCC) Led Lighting Laser Damage Moisture Absorption Oxide Thickness Plasma Etching Patterning Technology Sic Mosfet Size Reduction Surface Morphology Silver Paste Surface Composition Si Film Thickness Subthreshold Swing(SS) Through Silicon Vias(TSV) Three Dimensional(3D) Thermal Stress Si Content Gan Power Device Inductively-Coupled Plasma(ICP) Thin Wafer Voltage Scan 22 Nm Turn-On Field Activation Energy Active Region Amorphous Silicon Film Cooling Ability Direct Contact Driving Capability External Quantum Efficiency Flow Path Film Characteristics Flow Rate Field Enhancement Factor Gap Distance Glass Doping High Aspect Ratio High-Intensity Laser Hard Switching Ionizing Radiation(IR) 4-Point Probe Liquid Flow Mems Technology Methyl- Material Cost Mobility Degradation Multiple Layers Oxide Spacer On/Off Current Ratio Power Operation Rheological Property Resistance Modulation Raman Spectroscopy Si Wafer Solder Joint Sn-Ag-Cu Solder Side Wall Vector Network Analyzer(VNA) Threshold Electric Field Thermal Oxide Vertical Transition 3d Interconnection Aging Process Absorption Layer Antenna Array Ag Paste Blue-Emitting Deposition Temperature Design Considerations Dc-Dc Converters Dielectric Structure Device Characteristics Etch Rates Electron Traps Electrical Contact Resistance Efficiency Enhancement Field-Effect Mobility Film Density Fluorescent Dye Freewheeling Diode Growth Temperature Generation X Guard Ring Hard Metal Ion Implantation Implantation Energy Interfacial Layer 20 Nm Low Contact Resistance Low Melting Point Low Electric Field Nano-Patterning Processing Temperature Processing Conditions Power Efficiency Reverse Conduction Recess Gate Radar System RF LDMOS S Characteristics Schottky Diode Screen Printing Process Scattering Parameters(S-parameters) Solar Cell Efficiency White Light-Emitting Tert-Butyl Various Conditions Thermal Management Amorphous Si Films Cooling Performance CNT-FED Current Drivability Chemical Vapor Deposition Cds Film Cigs Solar Cell Differential Scanning Calorimetry(photo-DSC) Epoxy System Fem Simulation Flat Panel Display(FPD) Frequency Variation Fowler-Nordheim Plots High Mobility Insn Solder Interface Layer Information Display Patterning Technique Light Emission Limiting Characteristics Minority Carrier Micro-Features Mechanical Stress Maximum Diameter Multi-Layer Poole-Frenkel Poly-Si Tft Organic Semiconductor P-Type And N-Type P- And N-Type Planarization Process Polymer Substrate Phonon Frequencies Power Output Relativistic Heavy Ion Collider Superjunction Mosfet Selective Etching Silicon Oxide Surface Texturing Solar Cells Volumetric Ratio Wafer Dicing Wearable Device Thickness Uniformity Surface Conditions Surface Smoothing Computer Vision(CV) Zener Diode Anisotropic Wet Etching Boron Concentration Corner Rounding Curing Process De-Embedded Flexible Electronics Field Plate High Power Applications Field Operation Growth Rate Geometrical Factor Interfacial Quality Phenomenological Models Koh Solution Kinetic Parameters Low Energy Metal Mesh Metal Electrode No-Flow Underfill Novel Process Nitride Layer Oxide Interface Plasma Application Power Module Reactive Ion Etching(RIE) Silicon Nitride Stencil Printing Solidification Process White Emitting Surface Design Stainless Steel Foil Substrate Thermal Interface Materials Insulated Gate Bipolar Transistor Viscosity Measurement Air Cooling Cooling Liquid Chemical Reaction(Biomimetic) Carbon Nanotubes Patterning Cost Reduction Cell Design Cathode And Anode Chromaticity Coordinates Dangling Bonds Decision Tree(DT) Drive Applications Effective Density Electric Vehicle(EV) Fine Pitch Feature Size Final Heat Treatment High Speed High Electric Field Impurity Content Laser Irradiation Liquid Cooling Large Area Lift-Off Process Memristor Device Neuromorphic Hardware Open Failure Organic Binder Printed Carbon Nanotubes Printing Method Processing Scheme Pulse Width Reverse-Conducting Igbt Reverse Recovery Rheological Behavior Relative Humidity Sintered Silver Simulation And Fabrication Shear Strength Sintering Process Steel Foil Substrates White Oleds Thin Structure Surface Pattern Simulation Results