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학술지 Novel Bumping Process for Solder on Pad Technology
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저자
최광성, 배호은, 배현철, 엄용성
발행일
201304
출처
ETRI Journal, v.35 no.2, pp.340-343
ISSN
1225-6463
출판사
한국전자통신연구원 (ETRI)
DOI
https://dx.doi.org/10.4218/etrij.13.0212.0302
협약과제
12MB1600, 웨이퍼레벨 3차원 IC 설계 및 집적기술, 최광성
초록
A novel bumping process using solder bump maker is developed for the maskless low-volume solder on pad (SoP) technology of fine-pitch flip chip bonding. The process includes two main steps: one is the aggregation of powdered solder on the metal pads on a substrate via an increase in temperature, and the other is the reflow of the deposited powder to form a low-volume SoP. Since the surface tension that exists when the solder is below its melting point is the major driving force of the solder deposit, only a small quantity of powdered solder adjacent to the pads can join the aggregation process to obtain a uniform, low-volume SoP array on the substrate, regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of 130 μm is successfully formed. © 2013 ETRI.
키워드
Low-volume solder on pad (SoP) technology, Maskless bumping, Powdered solder, Resin, Sn3.0Ag0.5Cu
KSP 제안 키워드
Aggregation process, Driving forces, Fine pitch, Flip-chip bonding, Organic Substrate, Solder On Pad, Solder bump, Surface tension(ST), low-volume, melting point