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학술지 Optimization of Material and Process for Fine Pitch LVSoP Technology
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저자
엄용성, 손지혜, 배현철, 최광성, 최흥섭
발행일
201308
출처
ETRI Journal, v.35 no.4, pp.625-631
ISSN
1225-6463
출판사
한국전자통신연구원 (ETRI)
DOI
https://dx.doi.org/10.4218/etrij.13.1912.0007
협약과제
12MB3200, 차세대 초박형 MCP 인쇄회로기판 모듈/SiP용 임베디드 PCB 모듈, 엄용성
초록
For the formation of solder bumps with a fine pitch of 130 μm on a printed circuit board substrate, low-volume solder on pad (LVSoP) technology using a maskless method is developed for SAC305 solder with a high melting temperature of 220°C. The solder bump maker (SBM) paste and its process are quantitatively optimized to obtain a uniform solder bump height, which is almost equal to the height of the solder resist. For an understanding of chemorheological phenomena of SBM paste, differential scanning calorimetry, viscosity measurement, and physical flowing of SBM paste are precisely characterized and observed during LVSoP processing. The average height of the solder bumps and their maximum and minimum values are 14.7 μm, 18.3 μm, and 12.0 μm, respectively. It is expected that maskless LVSoP technology can be effectively used for a fine-pitch interconnection of a Cu pillar in the semiconductor packaging field. © 2013 ETRI.
키워드
Fine pitch, Maskless bumping, PCB, Resin, Sn/3.0Ag/0.5Cu, Solder powder
KSP 제안 키워드
Cu pillar, Differential scanning calorimetry(photo-DSC), Fine pitch, Melting temperature(Tm), Scanning calorimetry(DSC), Semiconductor packaging, Solder On Pad, Solder bump, Solder resist, low-volume, printed circuit board(PCB)