상세정보
학술지
Preliminary Works of Contact via Formation of LCD Backplanes Using Silver Printing
- 발행일
- 201308
- 출처
- ETRI Journal, v.35 no.4, pp.571-577
- ISSN
- 1225-6463
- 출판사
- 한국전자통신연구원 (ETRI)
- 초록
- The fabrication of a thin-film transistor backplane and a liquid-crystal display using printing processes can eliminate the need for photolithography and offers the potential to reduce the manufacturing costs. In this study, we prepare contact via structures through a poly(methyl methacrylate) polymer insulator layer using inkjet printing. When droplets of silver ink composed of a polymer solvent are placed onto the polymer insulator and annealed at high temperatures, the silver ink penetrates the interior of the polymer and generates conducting paths between the top and bottom metal lines through the partial dissolution and swelling of the polymer. The electrical property of various contact via-hole interconnections is investigated using a semiconductor characterization system. © 2013 ETRI.
- 키워드
- Conductivity, Contact via, Inkjet printing, LCD, Organic thin-film transistors, Penetration, Silver ink
- KSP 제안 키워드
- High Temperature, Insulator layer, Organic thin-film transistors, Partial dissolution, Polymer insulator, Thin-Film Transistor(TFT), Via-hole, electrical properties(I-V curve), inkjet printing, liquid crystal display(LCD), manufacturing cost