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Journal Article
Preliminary Works of Contact via Formation of LCD Backplanes Using Silver Printing
- Authors
- Yong Suk Yang, In-Kyu You, Hyun Han, Jae Bon Koo, Sang Chul Lim, Soon-Won Jung, Bock Soon Na, Hye-Min Kim, Minseok Kim, Seok-Hwan Moon
- Issue Date
- 2013-08
- Citation
- ETRI Journal, v.35, no.4, pp.571-577
- ISSN
- 1225-6463
- Publisher
- 한국전자통신연구원 (ETRI)
- Language
- English
- Type
- Journal Article
- Abstract
- The fabrication of a thin-film transistor backplane and a liquid-crystal display using printing processes can eliminate the need for photolithography and offers the potential to reduce the manufacturing costs. In this study, we prepare contact via structures through a poly(methyl methacrylate) polymer insulator layer using inkjet printing. When droplets of silver ink composed of a polymer solvent are placed onto the polymer insulator and annealed at high temperatures, the silver ink penetrates the interior of the polymer and generates conducting paths between the top and bottom metal lines through the partial dissolution and swelling of the polymer. The electrical property of various contact via-hole interconnections is investigated using a semiconductor characterization system. © 2013 ETRI.
- KSP Keywords
- Electrical properties, High Temperature, Inkjet printing, Insulator layer, Liquid crystals(LCs), Liquid-crystal display(LCD), Partial dissolution, Polymer insulator, Thin-Film Transistor(TFT), Via-hole, manufacturing cost