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학술지 Optical Chip-to-Chip Link System by Using Optical Wiring Method for Reducing EMI
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저자
조인귀, 윤재훈, 정명영, 박효훈
발행일
201008
출처
IEEE Transactions on Advanced Packaging, v.33 no.3, pp.722-728
ISSN
1521-3323
출판사
IEEE
DOI
https://dx.doi.org/10.1109/TADVP.2010.2049018
협약과제
10MR4900, 10W이하 RF에너지 전송 및 재생기술개발, 윤재훈
초록
This paper describes a new optical link system which consists of a metal optical bench, a module printed circuit board, a driver/receiver integrated circuit, a vertical-cavity surface-emitting laser/photo diode (VCSEL/PD) array, and an optical link block with plastic optical fibers for reducing electromagnetic interference (EMI) noise. For the optical interconnection between the light-sources and detectors, an optical wiring method whose distinctive features include the absence of EMI noise and easy assembly is proposed. The results clearly demonstrate that the use of an optical wiring method can provide robust, cost-effective assembly and easy-repair. We successfully achieved a 4.5 Gb/s data transmission rate without EMI problems. © 2006 IEEE.
키워드
Electromagnetic interference (EMI), integrated optoelectronics, optical fiber connecting, optical interconnections, plastic optical fibers (POFs)
KSP 제안 키워드
Data transmission rate, Distinctive features, EMI noise, Electromagnetic interference, Integrated circuit, Optical fiber connecting, Optical interconnection, Photo diode, Wiring method, chip-to-chip, cost-effective