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학술지 Novel Maskless Bumping for 3D Integration
Cited 35 time in scopus Download 2 time Share share facebook twitter linkedin kakaostory
저자
최광성, 성기준, 임병옥, 배현철, 정성혜, 문종태, 엄용성
발행일
201004
출처
ETRI Journal, v.32 no.2, pp.342-344
ISSN
1225-6463
출판사
한국전자통신연구원 (ETRI)
DOI
https://dx.doi.org/10.4218/etrij.10.0209.0396
협약과제
09MB3700, 웨이퍼레벨 3차원 IC 설계 및 집적기술, 최광성
초록
A novel, maskless, low-volume bumping material, called solder bump maker, which is composed of a resin and low-melting-point solder powder, has been developed. The resin features no distinct chemical reactions preventing the rheological coalescence of the solder, a deoxidation of the oxide layer on the solder powder for wetting on the pad at the solder melting point, and no major weight loss caused by outgassing. With these characteristics, the solder was successfully wetted onto a metal pad and formed a uniform solder bump array with pitches of 120 μm and 150 μm. Copyright © 2010 ETRI.
키워드
Low-melting-point solder, Maskless bumping, Solder bump maker (SBM)
KSP 제안 키워드
3D Integration, Low melting, Oxide layer, Solder bump, chemical reaction(Biomimetic), low-volume, melting point, weight loss