ETRI-Knowledge Sharing Plaform

ENGLISH

성과물

논문 검색
구분 SCI
연도 ~ 키워드

상세정보

학술지 Characteristics of Via-Hole Interconnections Fabricated by Using an Inkjet Printing Method
Cited 5 time in scopus Download 0 time Share share facebook twitter linkedin kakaostory
저자
양용석, 유인규, 구재본, 이상석, 임상철, 강승열, 노용영
발행일
201012
출처
Journal of the Korean Physical Society, v.57 no.61, pp.1699-1701
ISSN
0374-4884
출판사
한국물리학회 (KPS)
DOI
https://dx.doi.org/10.3938/jkps.57.1699
초록
Inkjet printing is a familiar technique that creates and releases droplets of fluid on demand and precisely deposits those droplets on a substrate. It has received increased attention for its novelty and ability to produce patterned and template material structures. In the application of electronic interconnection fabrication, drop-on-demand inkjet printers especially offer the advantages of contactless printing and eliminat the use of a die or photomask. In this study, we created a via-hole interconnecting structure through a polymer insulator layer by using an inkjet printing. When the droplets of Ag ink were dropped onto a PMMA/Au/Cr/SiO2/Si area and the Ag film was annealed at high temperatures, the Ag ink containing solvents penetrated into the PMMA layer and generated the conducting paths between the top Ag and the bottom Au electrodes by partial dissolution and swelling of the polymer. The surface and the cross-sectional topologies of the formed via-holes were investigated by using an optical microscope and a field emission transmission electron microscope.
키워드
Ag ink, Conductivity, FETEM, Inkjet printing, Organic thin-film transistors, Via-hole
KSP 제안 키워드
Ag film, Ag ink, Au electrode, Cross-sectional, Drop-on-demand(DOD), High Temperature, Inkjet printer, Insulator layer, Optical microscope, Organic thin-film transistors, Partial dissolution