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학술지 Chemo-Rheological Characteristics of a Self-Assembling Anisotropic Conductive Adhesive System Containing a Low-Melting Point Solder
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저자
백지원, 장건수, 엄용성, 문종태, 김종민, 남재도
발행일
201010
출처
Microelectronic Engineering, v.87 no.10, pp.1968-1972
ISSN
0167-9317
출판사
Elsevier
DOI
https://dx.doi.org/10.1016/j.mee.2009.12.020
협약과제
09MB4300, 도전 및 접합 기능을 갖는 하이브리드형 언더필 소재 개발, 엄용성
초록
To achieve the excellent wettability of a solder in an anisotropic conductive adhesive (ACA) in micro-packaging technology, not only the removal of the oxidized layer of the solder but also the chemo-rheological phenomena of the thermally induced self assembly of low-melting temperature solder powders were investigated for ACA applications. Both the optimum kind and amount of reductant were determined in this study to remove the oxidized layer formed on the solder surface in ambient environment. The solder wetting test was performed to observe the chemical and rheological compatibility between the solder, polymer matrix, and reductant. The thermal analysis was done using differential scanning calorimetry (DSC) analysis and rheometer test. Several chemical reactions by the reductant were proposed, and the mechanisms were postulated. It is believed that the reductant reacts with the oxidized layer, amine, and epoxide group, respectively. The relation between conversion and glass transition temperature of the polymer matrix was also obtained from DSC. © 2009 Elsevier B.V. All rights reserved.
키워드
Anisotropic conductive adhesive, Chemo-rheology, Low-melting point solder, Reductant
KSP 제안 키워드
Differential scanning calorimetry(photo-DSC), Differential scanning calorimetry (dsc), Glass transition temperature, Low melting, Melting temperature(Tm), Oxidized layer, Packaging technology, Rheological characteristics, Rheological phenomena, Thermal Analysis, Thermally induced