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Conference Paper Cost-Effective Thermoelectric Cooler Packaging Using Hybrid Cu Paste
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Authors
Hyun-Cheol Bae, Yong-Sung Eom, Aesun Oh, Haksun Lee, Kwang-Seong Choi, Seung Eon Moon, Jin Ho Lee
Issue Date
2015-09
Citation
European Microelectronics and Packaging Conference (EMPC) 2015, pp.1-4
Language
English
Type
Conference Paper
KSP Keywords
Cu paste, Thermoelectric cooler, cost-effective
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