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Conference Paper Electrically Conductive Paste with Copper for Flexible Packaging Application

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Authors: Yong-Sung EOM, Jihye SON, Hyun-Cheol BAE, Haksun Lee, Kwang-Seong CHOI, Seung-Eon MOON

Issue Date: 2015-10

Citation: International Symposium on Microelectronics and Packaging (ISMP) 2015, pp.144-144

Language: English

Type: Conference Paper

KSP Keywords: Conductive paste, Electrically conductive, Flexible packaging

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