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학술대회 A Novel Packaging Method of Fully Passive Optical Alignment for Multi-Chennel Optical Interconnection Module
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저자
임권섭, 강현서, 장재형
발행일
201512
출처
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) 2015, pp.156-158
DOI
https://dx.doi.org/10.1109/EDAPS.2015.7383690
협약과제
15ZI2100, 지역산업연계 ICT 융합기술 산업화 지원 사업, 강현서
초록
In this paper, a novel packaging method of fully passive optical alignment and surface mounting for parallel optical interconnects modules has been developed for a high-capacity data transmission such as chip-to-chip and board-to-board interconnects within smart device and interconnects between devices.
키워드
multi-channel, optical interonnect, packaging method, passive alignlement
KSP 제안 키워드
Board-to-board, Data transmission, High-capacity, Optical Interconnect(OI), Optical interconnection module, Smart devices, Surface mounting, chip-to-chip, multi-channel, optical interonnect, packaging method