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Characterization of Polymer Matrix and Low Melting Point Solder for Anisotropic Conductive Film
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- Authors
- Yong-Sung Eom, Ji-Won Baek, Jong-Tae Moon, Jae-Do Nam, Jong-Min Kim
- Issue Date
- 2008-02
- Citation
- Microelectronic Engineering, v.85, no.2, pp.327-331
- ISSN
- 0167-9317
- Publisher
- Elsevier
- Language
- English
- Type
- Journal Article
- Abstract
- The chemo-rheological mechanisms of a polymer matrix and a low melting point solder for an anisotropic conductive film (ACF) have been characterized. For the material characterization of the polymer matrix and solder, a differential scanning calorimetry (DSC) and a dynamic mechanical analyzer (DMA) experiments were conducted. The conversion and viscosity of the polymer matrix was observed by DSC and DMA, respectively. In order to control the curing conditions such as the reaction temperature and time of polymer matrix, the adequate amount of catalyst was used. The compatibility between the viscosity of a polymer matrix and a melting temperature of solder was characterized to optimize the processing cycle. The reductant was also added to remove the oxide layer performed on the surface of solder in the air environment. Based on these chemo-rheological phenomena of the polymer matrix and solder, the optimum polymer system and its processing cycle were designed for the high performance and reliability in the electrical interconnection system. © 2007 Elsevier B.V. All rights reserved.
- KSP Keywords
- Amount of catalyst, Anisotropic Conductive Films(ACFs), Curing conditions, Differential scanning calorimetry(photo-DSC), Differential scanning calorimetry (dsc), Dynamic mechanical analyzer, High performance, Material Characterization, Melting temperature(Tm), Performance and Reliability, Polymer system