상세정보
학술지
Characterization of Polymer Matrix and Low Melting Point Solder for Anisotropic Conductive Film
- 발행일
- 200802
- 출처
- Microelectronic Engineering, v.85 no.2, pp.327-331
- ISSN
- 0167-9317
- 출판사
- Elsevier
- 협약과제
- 07MB3400, 차세대 ACF 소재 및 공정기술개발, 엄용성
- 초록
- The chemo-rheological mechanisms of a polymer matrix and a low melting point solder for an anisotropic conductive film (ACF) have been characterized. For the material characterization of the polymer matrix and solder, a differential scanning calorimetry (DSC) and a dynamic mechanical analyzer (DMA) experiments were conducted. The conversion and viscosity of the polymer matrix was observed by DSC and DMA, respectively. In order to control the curing conditions such as the reaction temperature and time of polymer matrix, the adequate amount of catalyst was used. The compatibility between the viscosity of a polymer matrix and a melting temperature of solder was characterized to optimize the processing cycle. The reductant was also added to remove the oxide layer performed on the surface of solder in the air environment. Based on these chemo-rheological phenomena of the polymer matrix and solder, the optimum polymer system and its processing cycle were designed for the high performance and reliability in the electrical interconnection system. © 2007 Elsevier B.V. All rights reserved.
- 키워드
- Anisotropic conductive film, High reliability, Low melting point solder
- KSP 제안 키워드
- Amount of catalyst, Anisotropic conductive film, Curing conditions, Differential scanning calorimetry(photo-DSC), Differential scanning calorimetry (dsc), Dynamic mechanical analyzer, High Reliability, High performance, Low melting point, Material Characterization, Melting temperature(Tm)