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학술지 Surface-micromachined MEMS Acoustic Sensor with Bottom Electrode Anchor
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저자
이재우, 김혜진, 이성규, 이상균, 고상춘, 박강호
발행일
200804
출처
Electronics Letters, v.44 no.9, pp.1-2
ISSN
0013-5194
출판사
IET
DOI
https://dx.doi.org/10.1049/el:20080401
협약과제
08MB1800, 유비쿼터스 단말용 부품 모듈, 김종대
초록
A capacitive MEMS acoustic sensor with two sacrificial layers based on surface micromachining on a GaAs substrate is presented. This sensor has bottom electrode anchors fabricated using an initial sacrificial layer for the formation of a back chamber. The bottom anchors serve to eliminate the back side process of the wafer for a conventional back chamber because the chamber is implemented through substrate surface etching. The proposed circular-type microphone has a diameter of 1.0mm and a gap height of 2m. It shows a pull down voltage of 8.5V and a total capacitance of 5.5pF. Additionally, the MEMS microphone has a sensitivity of 0.09mV/Pa at 1kHz at a bias of 2V. © The Institution of Engineering and Technology 2008.
KSP 제안 키워드
Acoustic Sensor, Bottom electrode, Capacitive MEMS, Circular-type, GaAs substrates, Gap height, MEMS Microphone, Sacrificial layer, Substrate surface, surface etching, surface micromachining