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학술지 Interdevice Isolation Characteristics for Design and Fabrication of 60-GHz WPAN SoCs
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저자
김성일, 이철욱, 윤석원, 강광용, 이해영
발행일
200806
출처
Microwave and Optical Technology Letters, v.50 no.6, pp.1699-1702
ISSN
0895-2477
출판사
John Wiley & Sons
DOI
https://dx.doi.org/10.1002/mop.23470
협약과제
07MB1400, THz파 발진 변환 검출기 및 신호원, 강광용
초록
The high interdevice isolation levels is one of the key technologies in the design and fabrication of 60-GHz WPAN SoC. To obtain proper interdevice isolation levels, we have analyzed and measured substrate coupling effects with various isolation techniques like a trench and implant structure. From the analyzed and measured results, the feasibility of the implant has confirmed to be applicable to the mm-wave SoC, and also derived an equivalent circuit form these results, which can be helpful to the design and fabrication of the 60-GHz WPAN SoC. © 2008 Wiley Periodicals, Inc.
키워드
60-GHz wireless personal area network (WPAN), Implant, Interdevice isolation, Mm-wave, System-on-a chip (SoC)
KSP 제안 키워드
60 GHz, Coupling effects, Design and fabrication, Equivalent Circuit, Interdevice isolation, Isolation technique, Key technology, Wireless personal area network(WPAN), millimeter wave(mmWave), substrate coupling