상세정보
학술지
Interchip Link System using an Optical Wiring Method
- 저자
- 조인귀, 류진화, 정명영
- 발행일
- 200808
- 출처
- Optics Letters, v.33 no.16, pp.1881-1883
- ISSN
- 0146-9592
- 출판사
- Optical Society of America(OSA)
- 협약과제
- 08MR1400, 광대역 RF안테나 측정기술 표준개발, 조인귀
- 초록
- A chip-scale optical link system is presented with a transmitter/receiver and optical wire link. The interchip link system consists of a metal optical bench, a printed circuit board module, a driver/receiver integrated circuit, a vertical cavity surface-emitting laser/photodiode array, and an optical wire link composed of plastic optical fibers (POFs). We have developed a downsized POF and an optical wiring method that allows on-site installation with a simple annealing as optical wiring technologies for achieving high-density optical interchip interconnection within such devices. Successful data transfer measurements are presented. © 2008 Optical Society of America.
- KSP 제안 키워드
- Data transfer, High-density, Integrated circuit, On-site installation, Photodiode array, Wiring method, optical link, plastic optical fiber, printed circuit board(PCB), vertical-cavity surface-emitting laser(VCSEL)