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Journal Article Chip-to-chip Optical Interconnect using Gold Long-range Surface Plasmon Polariton Waveguides
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Authors
Jin Tae Kim, Jung Jin Ju, Sun Tak Park, Min-Su Kim, Seung Koo Park, Myung-Hyun Lee
Issue Date
2008-08
Citation
Optics Express, v.16, no.17, pp.13133-13138
ISSN
1094-4087
Publisher
Optical Society of America(OSA)
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.1364/OE.16.013133
Abstract
We demonstrate a novel on-board chip-to-chip optical interconnect using long-range surface plasmon polariton (LR-SPP) waveguides that feature 2.5-cm-long gold strips embedded in a low loss polymer cladding. A TM-mode vertical-cavity surface-emitting laser (VCSEL) operating at a wavelength of 1.3 μm was butt-coupled into the waveguides in order to excite a fundamental LR-SPP mode and then the transmitted light was received with a photo-diode (PD). The waveguide width is varied in the range of 1.5-5.0 μm in order to optimize the insertion loss where the 3-μm-wide waveguide provides a minimum insertion loss of -17 dB, consisting of 6 dB/cm propagation loss and 2 dB coupling loss. An interconnect system based on the optimized waveguide with a 4-channel array is assembled with the arrayed optoelectronic chips. It shows the feasibility of 10 Gbps (2.5 Gbps × 4 channels) signal transmission indicating that the LR-SPP waveguide is a potential transmission line for optical interconnection. © 2008 Optical Society of America.
KSP Keywords
Coupling loss, Low loss polymer, On-board, Optical interconnection, Photo diode, Polymer cladding, Propagation loss, Signal transmission, Surface plasmon(SP), TM mode, Transmission line
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CC BY