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학술대회 A Feasibility Study of Antenna in a Package Technology for 40GHz Front-End Module
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저자
변우진, 김봉수, 김광선, 김종면, 송명선
발행일
200812
출처
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) 2008, pp.198-201
DOI
https://dx.doi.org/10.1109/EDAPS.2008.4736034
협약과제
08MR4500, 스펙트럼 공학 및 밀리미터파대 전파자원 이용기술개발, 김창주
초록
In this paper, a front-end module integrated with a planar dipole antenna based on LTCC technology is proposed and its feasibility is studied at 40GHz band. Front-end module is a part of 40GHz transceiver and consists of a single pole double throw (SPDT) switch, a laminated waveguide filter and a planar dipole antenna. The proposed structure shows good agreements between measured and simulated results. Size of the proposed structure is 27.5 × 5.85 mm2. © 2008 IEEE.
KSP 제안 키워드
End Module, Feasibility study, Front-End, GHz band, LTCC Technology, Laminated Waveguide, Package Technology, Single pole double throw, Waveguide filter, planar dipole antenna