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학술지 Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)
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임병승, 김종민, 전성호, 이성혁, 김주헌, 한정근, 엄용성, 신영익
Materials Transactions, v.50 no.7, pp.1684-1689
Japan Institute of Metals
09MB4300, 도전 및 접합 기능을 갖는 하이브리드형 언더필 소재 개발, 엄용성
In this paper, we discuss our design of a new class of low-melting-point alloy (LMPA)-filled anisotropically conductive adhesives (ACA) and a self-organized interconnection process for using these adhesives, and we demonstrate a good electrical conduction for the process. Flow, melting, coalescence, and wetting characteristics of LMPA fillers in the ACA facilitate this process. In order to exploit good coalescence and wetting characteristics of LMPA fillers, the polymer matrix has a sufficient fluxing capability against oxide films of both LMPA fillers and electrode materials. Furthermore, it is essential that the polymer have a low viscosity level around the melting point of the incorporated LMPA to achieve a good electrical conduction path.In order to study coalescence and wetting characteristics, we formulated two types of ACA with different volume fractions of LMPA filler (10 vol % and 40 vol%). Our test board had an 18-μm thick Cu line-type pattern (10 mm × 0.1 mm) and an area array-type pattern (square type: 0.1 mm × 0.1 mm, circle type: ??, 0.1 mm) with five different pitches (50 μm to 250 μm). We measured thermal properties of the ACA by differential scanning calorimetry (DSC), and we determined a temperature profile for the interconnection process. We then monitored coalescence and wetting characteristics of LMPA fillers and morphology of conduction path in ACA by using a microfocusing X-ray inspection system and an optical microscope.We determined that the developed LMPA-filled ACA have good coalescence and wetting characteristics regardless of pattern types. In addition, we were able to achieve a good electrical conduction path because of the coalescence and wetting characteristics of the LMPA fillers in the ACA. ©2009 The Thermoelectrics Society of Japan.
Coalescence, Electrically conductive adhesive, Fluxing capability, Low-melting-point alloy, Self-organized interconnection, Tin-bismuth wettability
KSP 제안 키워드
Anisotropically conductive adhesives, Array-type, Conduction path, Differential scanning calorimetry(photo-DSC), Differential scanning calorimetry (dsc), Low viscosity, Low-melting-point alloy, Optical microscope, Oxide film, Self-organized, Temperature profile