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Journal Article 삼차원 적층 패키징 기술 동향
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Authors
최광성
Issue Date
2009-09
Citation
전자공학회지, v.26, no.9, pp.51-60
ISSN
1016-9288
Publisher
대한전자공학회 (IEIE)
Language
Korean
Type
Journal Article
Project Code
09MB3700, Wafer Level 3D IC Design and Integration, Choi Kwang-Seong