ETRI-Knowledge Sharing Plaform

KOREAN

BROWSE

Titles

Home Titles Articles

논문 검색
Type		SCI
Year	~	Keyword

Detail

List

Journal Article 삼차원 적층 패키징 기술 동향

Cited - time in scopus

scopus

Download 1 time Share share

Authors: 최광성

Issue Date: 2009-09

Citation: 전자공학회지, v.26, no.9, pp.51-60

ISSN: 1016-9288

Publisher: 대한전자공학회 (IEIE)

Language: Korean

Type: Journal Article

Project Code: 09MB3700, Wafer Level 3D IC Design and Integration, Choi Kwang-Seong

Copyright Policy Privacy Policy

ETRI

218 Gajeong-ro, Yuseong-gu, Daejeon, 34129, KOREA, Contact: sh.kim@etri.re.kr

2016 Electronics and Telecommunications Research Institute. All rights reserved.

Please refrain from automatic collection of e-mail addresses posted on this homepage.