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구분 SCI
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학술지 Electrohydrodynamic Micropatterning of Silver Ink using Near-Field Electrohydrodynamic Jet Printing with Tilted-Outlet Nozzle
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저자
윤두협, 김성현, 양용석, 임상철, 김성진, 안수환, 심효선, 유승명, 신동욱, 유지범
발행일
200910
출처
Applied Physics A : Materials Science & Processing, v.96 no.4, pp.933-938
ISSN
0947-8396
출판사
Springer
DOI
https://dx.doi.org/10.1007/s00339-009-5262-7
초록
This paper introduces for the first time near-field electrohydrodynamic jet printing with tilted-outlet nozzle to obtain the fine and highly conductive patterns of silver (Ag) ink. Line widths produced by near-field electrohydrodynamic jet printing are less than 6 μm, which is approximately twenty times smaller than that of inkjet printing. Under optimized Ag ink annealing ranges 3-9 min for 30 wt% at 150°C, we observed Ag line pattern resistivities as low as 7×10-6 廓 cm. Ag ink conduction mechanisms were brought to light from microstructure analysis and post-thermal-annealing examination of electrical characteristics. © 2009 Springer-Verlag.
KSP 제안 키워드
Ag ink, Electrohydrodynamic jet printing, Microstructure analysis, conduction mechanism, electrical characteristics, highly conductive, inkjet printing, line pattern, near-field, silver ink