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학술지 Catalytic Behavior of Sn/Bi Metal Powder in Anhydride-Based Epoxy Curing
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저자
장건수, 엄용성, 문종태, 오용수, 남재두
발행일
200912
출처
Journal of Nanoscience and Nanotechnology, v.9 no.12, pp.7461-7466
ISSN
1533-4880
출판사
American Scientific Publishers (ASP)
DOI
https://dx.doi.org/10.1166/jnn.2009.1752
협약과제
09MB4300, 도전 및 접합 기능을 갖는 하이브리드형 언더필 소재 개발, 엄용성
초록
In this paper, we report the catalytic activity of the Sn/Bi alloy beads and its acceleration of the exothermic epoxy curing reactions in various thermal conditions and bead compositions. As being used as low-melting solder balls in electronic interconnection processes with various epoxy systems, it was found that the Sn/Bi beads substantially lowered the exothermic peak temperature of the diglycidyl ether of bisphenol A (DGEBA)/anhydride systems in up to ca. 140 °C depending on different types of anhydride curing agents. The catalytic activation of Sn/Bi powder was initiated with a small amount of Sn/Bi powder, for example, lowering ca. 50 °C of the exothermic peak temperature by adding only 0.1 vol% of Sn/Bi powder. The catalytic capability of the powder was increased by using smaller sized beads corresponding to larger catalytic surface area at the same volume fraction. Exhibiting a latent catalytic effect, the catalytic activity of Sn/Bi powder was remained latent at temperatures lower than 100 °C in isothermal conditions. © 2009 American Scientific Publishers. All rights reserved.
키워드
Anisotropic conductive film, Metal catalyst, Thermal latent catalysis, Thermosetting polymer
KSP 제안 키워드
Anisotropic conductive film, Catalytic activation, Catalytic behavior, Catalytic capability, Curing reactions, Epoxy curing, Low melting, Metal catalyst, Peak temperature, Solder ball, Surface Area